International collaboration EU and Japan on semiconductors
DIGITAL-JU-CHIPS-2026-SG-JAPAN · DIGITAL-JU-SIMPLE · TRL 5–7
What this call funds
This call funds joint EU-Japan projects on advanced semiconductor packaging and chiplet technology, aiming to make chips smaller, faster and easier to combine from different manufacturers. It targets solutions that are already tested in labs and pilot lines and ready to be proven in real semiconductor manufacturing settings. Around two projects will be funded from a total budget of 5 million euros.
semiconductors · advanced manufacturing · deep tech · photonics
Who wins this
This call suits industry-research consortia in Europe and Japan working on chip packaging and chiplet interoperability who are ready to validate their technology in real manufacturing environments.
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The call in detail
- Indicative grant size
- €3M–€5M
- Funding model
- DIGITAL-AG
- Submission
- Single-stage submission (full proposal at once)
- Type of action
- DIGITAL JU Simple Grants
- Partners
- Not stated in the call.
- Also required
- Detailed eligibility, admissibility, evaluation and financial conditions are defined in Appendix 8 of the Chips for Europe Initiative Work Programme rather than in this call text.
- Sectors
- AI/ML · Cybersecurity · Deep Tech
Read the full conditions from the official call ›
Conditions 1. Admissibility conditions: Proposal page limit and layout described in Appendix 8 of Work Programme - Chips for Europe Initiative call document. Proposal page limits and layout: described in Part B of the Application Form available in the Submission System. 2. Eligible countries described in Appendix 8 of Work Programme - Chips for Europe Initiative. 3. Other eligibility conditions Appendix 8 of Work Programme - Chips for Europe Initiative. 4. Financial and operational capacity and exclusion described Appendix 8 of Work Programme - Chips for Europe Initiative. 5a. Evaluation and award: Submission and evaluation processes described Appendix 8 of Work Programme - Chips for Europe Initiative and the Online Manual. 5b. Evaluation and award: Award criteria, scoring and thresholds described Appendix 8 of Work Programme - Chips for Europe Initiative. 5c. Evaluation and award: Indicative timeline for evaluation and grant agreement described in Appendix 8 of Work Programme - Chips for Europe Initiative. 6. Legal and financial set-up of the grants described Appendix 8 of Work Programme - Chips for Europe Initiative. Call Details Call document and annexes: Model Grant Agreements (MGA) DEP MGA
Who has won calls like this
No past winners are recorded for this call family yet.