IA Resilience call reinforcing Europe's strenght in power electronics
HORIZON-JU-CHIPS-2026-FT1-IA · HORIZON-JU-IA · Needs partners
What this call funds
This call funds innovation projects in power electronics, aiming to strengthen Europe's position in wide-bandgap semiconductor materials (GaN, SiC), devices, packaging, and AI-enhanced power systems. It supports work across the value chain from substrates and manufacturing platforms to advanced packaging integration and characterization techniques. The goal is to reduce EU dependency on external suppliers and boost competitiveness in advanced power semiconductor technology.
semiconductors · advanced materials · artificial intelligence · energy efficiency · advanced manufacturing
Who wins this
This call suits industrial consortia and research organisations working on advanced power semiconductor materials, devices, packaging, or AI-driven power electronics innovation across the value chain.
Could you win this call?
We read your site to see what you build.
The call in detail
- Indicative grant size
- €1M–€10M
- Funding model
- Budget-based — reimbursement of actual eligible costs
- Submission
- Single-stage submission (full proposal at once)
- Type of action
- HORIZON JU Innovation Actions
- Partners
- Required. The call asks for a consortium — a group applying together, typically 3+ organisations from 3+ countries.
- Also required
- Detailed eligibility, financial capacity, and evaluation conditions are specified in Appendix 7 of the Chips JU Work Programme rather than in the call text itself.
- Eligible countries (45)
- Austria, Belgium, Bulgaria, Croatia, Cyprus, Czechia, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Norway, Iceland, Switzerland, United Kingdom, IL, TR, UA, RS, MK, ME, AL, BA, XK, GE, AM, MD, TN, NZ
Read the full conditions from the official call ›
General conditions 1. Admissibility conditions: Proposal page limit and layout Proposal page limits and layout: detailed in Part B of the Application Form, which you can access from the Call documents section on the Chips JU website's Call page The following information are all described in the Appendix 7 of the Chips JU Workprogramme 2. Eligible countries 3. Other Eligibility Conditions 4. Financial and operational capacity and exclusion 5a. Evaluation and award: Award criteria, scoring and thresholds 5b. Evaluation and award: Submission and evaluation processes 5c. Evaluation and award: Indicative timeline for evaluation and grant agreement 6. Legal and financial set-up of the grants Specific conditions Please visit the Chips JU website's Call page Calls documents Please refer to the calls documents section on the Chips JU website's Call page to view and download all required documents and templates. Specific documents 2026 Guide for Applicants RIA_IA_FT-FPP Evaluation Form Chips IA RIA FT-FPP Template Application form Part B IA-RIA-FT FPP Ownership Control Declaration form template National Budgets Table template (xls) General documents Chips JU Multiannual Work Programme Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026 PAB decision on the evaluation and selection procedures related to Calls for Proposals ECS Strategic Research and Innovation Agenda Rules for legal entity validation, LEAR appointment, financial capacity and ownership control assessment Annotated Model Grant Agreement for EU Funding Programmes 2021-2027
Who has won calls like this
No past winners are recorded for this call family yet.