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    HORIZON-JU-CHIPS-2026-2-CSA

    Supply chain resilience CSA

    Closing soon · 28 daysLive official EU data

    HORIZON-JU-CHIPS-2026-2-CSA · HORIZON-JU-CSA · Needs partners

    22 Sep 2026
    Deadline
    €500k–€2M
    Indicative, per project
    ~1
    Grants expected
    1
    Past winners in this family

    What this call funds

    This grant funds a coordination and support action to build a shared data platform that maps and monitors the semiconductor supply chain across Europe. It aims to let companies securely share anonymized data so regulators and industry can spot risks, run stress tests, and issue early warnings before supply chain crises hit. The project acts like a digital twin of the chip supply chain, managed by a trusted intermediary.

    semiconductors · data analytics · digital twins · cybersecurity · advanced manufacturing

    Who wins this

    This call suits a consortium of research organisations, industry associations, or trusted data infrastructure providers with expertise in semiconductor supply chains and secure data sharing to build an EU-wide monitoring platform.

    Could you win this call?

    We read your site to see what you build.

    The call in detail

    Indicative grant size
    €500k–€2M
    Funding model
    Budget-based — reimbursement of actual eligible costs
    Submission
    Single-stage submission (full proposal at once)
    Type of action
    HORIZON JU Coordination and Support Actions
    Partners
    Required. The call asks for a consortium — a group applying together, typically 3+ organisations from 3+ countries.
    Also required
    Most eligibility and admissibility conditions are deferred to Appendix 7 of the Work Programme rather than stated in this text.
    Eligible countries (45)
    Austria, Belgium, Bulgaria, Croatia, Cyprus, Czechia, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Norway, Iceland, Switzerland, United Kingdom, IL, TR, UA, RS, MK, ME, AL, BA, XK, GE, AM, MD, TN, NZ
    Read the full conditions from the official call ›

    General conditions 1. Admissibility conditions: Proposal page limit and layout described in the Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026. Proposal page limits and layout: described in Part B of the Application Form available in the Submission System. 2. Eligible countries described in the Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026. A number of non-EU/non-Associated Countries that are not automatically eligible for funding have made specific provisions for making funding available for their participants in Horizon Europe projects. See the information in the Horizon Europe Programme Guide. 3. Other Eligibility Conditions described in the Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026. 4. Financial and operational capacity and exclusion described in the Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026. 5a. Evaluation and award: Award criteria, scoring and thresholds described in the Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026. 5b. Evaluation and award: Submission and evaluation processes described in the Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026. 5c. Evaluation and award: Indicative timeline for evaluation and grant agreement described in the Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026. 6. Legal and financial set-up of the grants described in the Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026 and in the Annex G of the Work Programme General Annexes. Specific conditions described in the topic conditions Call Details

    Who has won calls like this

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